First Demonstration of an Ultra-Wide Bandgap Power Module through Device-Package, Electro-Thermo-Mechanical Co-Optimization

Hehe Gong, Xin Yang, Boyan Wang, Zichen Zhang, Qingrui Yuchi, Zineng Yang, Zhengpeng Wang, Matthew Porter, Hongchang Cui, Yuan Qin, Yibo Wang, Xiaosheng Wang, Chaoqiang Jiang, Rong Zhang, Han Wang, Dong Dong, Jiandong Ye, Guoquan Lu, Yuhao Zhang*
December 2025
Link
Type
Conference paper
Publication
In 2025 IEEE International Electron Devices Meeting (IEDM)
Hehe Gong
Hehe Gong

Ph.D Nanjing University
B.S.Northwestern Polytechnical University
Xin Yang
Xin Yang

M.S. Xi'an Jiaotong University
B.S. Chongqing University
Zineng Yang
Zineng Yang

M.Sc. RWTH Aachen University
B.Eng. (Hons) University of Nottingham Ningbo/University of Nottingham
Hongchang Cui
Hongchang Cui

M.S. Xi'an Jiaotong University
B.S. China University of Mining and Technology